CircuitNuggets is a self-funded engineering service company, currently located in Shenzhen, China.
We proposed a new approach of on-die powering mechanism.
We proposed a silicon proved new approach of on-die powering that delivers power directly to transistors with sub-nanosecond transient response, removing the need for package and PCB power delivery. Co-packaged and PCB capacitors can be reduced by up to 100%. In some cases, the PCB is no longer needed at all.
PDN and power integrity problems get worse at advanced process nodes. Addressing them takes serious engineering effort at every level: die, package, PCB, and system. It also limits chip performance and design flexibility. We provide a way to solve those problems.
Simplified Package and PCB
Traditionally, package and PCB handle two jobs at once: deliver power (PDN) and deliver signal. With our approach, they only need to carry signals, which simplifies design and material requirements.
Fewer Conversion Stages
Power goes from HVDC straight to on-die transistors. Fewer converters in the path.
Thermal Efficiency
With powering circuit on die, thermal path is much more direct. It shares the cooling system with other circuits on the same die. Compared to chiplet approaches, this is a real advantage.
Process Compatibility
Works with logic, memory, RF, and analog. Tested across multiple semiconductor processes.
We provide live demo of verification chip on APEC 2026 booth 2220. Chip and board can provide to selected customer to do their own test.
We are currently looking for an exclusive partner, please contact 
CircuitNuggets is a PSMA member
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